Digital Engineering October/November 2023

Our October/November digital issue focuses on innovative approaches to toy design, along with digital twins and smart cities, new workstation monitors, and a review of the HP Z4 G5 computer.

Inside This Issue:

Engineering Toys—To Infinity and Beyond

As engineering design tools advance, so does the toy industry in its design and production.

Playful Visualization

From texture to packaging, toy designers rely on rendering programs to bring ideas to life.

Reimagining Toy Production With 3D Printing 

3D printing promises greater creativity and customization for toys and enables on-demand production. 

Twin Tech and the Smart City: A Natural Pairing?

The question is whether the digital twin can take the smart city into the mainstream.

Monitor Modifications

Blacker blacks and fewer blues highlight workstation monitor trends. 

Review: Perfect Portable Productivity

The SideTrak Swivel 14 turns any laptop into a dual-screen workstation.

Review: Powerful but Pricey: HP Z4 G5 Workstation

HP updates its best-selling desktop workstation.

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Latest News

Indy Autonomous Challenge to Returns to Indianapolis Speedway
Race set to feature a head-to-head race of possibly the fastest autonomous racecars piloted by artificial intelligence driver software, organizers...

Desktop Metal Releases Binder Jet 3D Printing Upgrade
The Production System P-1 metal binder jet 3D printer will be offered with a Reactive Safety Kit for high-speed production...

MathWorks Advances Software-Defined Workflows with NVIDIA’s Help
Developers can use their existing MATLAB Algorithm Codebase to develop and deploy AI-enabled applications via the NVIDIA Holoscan platform.

AI in Design: In Need of New Hardware
New hardware options are emerging to support artificial intelligence use cases.

Can AI Eat Itself?
Looks like synthetic training data is here to stay—it's something engineering organizations should keep a close eye on.

Sustainable Packaging Requires an Innovative Data-Driven Ecosystem 
Sustainable packaging is a complex challenge that cuts across several evolving manufacturing developments.

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