Digital Engineering July/August 2023
The July/August issue of Digital Engineering focuses on innovations in electronics design, including cloud-based ECAD, electronic toy design, PLM for electronics, quality control in 3D printing, and a review of the BOXX APEXX S3 workstation.
August 1, 2023
Inside This Issue:
Subscription-Based Software: The New Normal?
Licensing models are slowly changing to be subscription based across the industry. But many organizations still use perpetual licensing.
SaaS Gains Ground in ECAD
Simulation drives ECAD to subscription.
Playful Magic and Functional Esthetics
Incorporating electronics to raise the bar for toys and accessories.
How Well Can PLM Support Electronics Developers?
Until now, PLM has made limited inroads into the electronics design and development sector.
Production-grade AM Gets Quality Boost
Advances in artificial intelligence, in-situ monitoring and process control are picking away at longstanding concerns about additive manufacturing part quality, but more work needs to be done.
Choosing the Right Computing Options for Enhanced Workflows
Getting the ideal hardware for your engineering applications isn’t just about the price tag.
Top Performance Winner: BOXX APEXX S3
The latest workstation from BOXX beats the performance of its predecessor.
Download today
Latest News
Product Development Teams Feeling the Need for Speed
Protolabs survey finds companies under pressure to get products to market faster while still juggling workforce challenges.
Sony, Siemens Enable Immersive Engineering with Jointly Created System
Siemens and Sony partner to bring NX Immersive Designer, including Sony's XR head-mounted display (HMD), SRH-S1, to market later this...
Siemens Unleashes Cloud-based 3D CAD/Engineering with NX X
Available in flexible deployment models, NX X enables design teams to access their critical toolset wherever and whenever, according to...
SprutCAM X Updates Feature Robots
This update introduces 99 changes containing bug fixes and workflow improvements.
Linux Foundation Announces High-Performance Software Foundation
HPSF aims to build a portable core software stack for HPC by increasing adoption.
RAPID + TCT 2024 Executive Keynote Series Announced
Event to feature industry leaders from across the ecosystem discussing the future of additive manufacturing.
All posts
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